C-Component offers cost-effective custom thick film circuits from simple one or two-print-sided substrates to high-complexity and fine line circuits with metallised vias, plated through holes, multilayers, integrated resistors, wraparounds and more special features.
Our in-house facilities and innovative thinking provide our Customers with a comprehensive service and engineering support for their demanding applications.

ADVANTAGES
CAPABILITIES
  • Various substrate materials including 96% and 99.6% alumina (Al2O3), aluminum nitride (AlN), Si3N4, sapphire, ferrite and more
  • Multiple metallisation schemes including  Ag, AgPd, Pd, Pt, Au 
  • Ni and NiAu (electroless or electrolytic) plating available
  • Wraparoud metallization (incl. selective)
  • Angled face metallization
  • Metallised via and plated through holes
  • Dielectric solder dams and protective glazes
  • Precise laser profiling and drilling
  • Diamond sawing for superior edge quality
  • Comprehensive testing facilities to ensure product quality
TECHNICAL DATA

See also