Thermally Conductive KC™ low cost ceramic substrates produced by C-Component is the best state-of-the-art solution for transferring excess heat from electronic devices to a heat sink.
KC™ substrates based on aluminium oxide (Al2O3) are greatly surpass mica or silicon pads in thermal conductivity and dielectric strength and provide the best performance for electronic devices, regardless of their power.
KC™ substrates made from aluminium nitride (AlN) are noted for their outstanding thermal conductivity, comparable to the conductivity of beryllium oxide-based ceramics, which are potentially carcinogenic. They are cheaper and safer than beryllia ceramics and exceed their price / quality ratio.